Japan's Mitsui Mining & Smelting Co on Friday unveiled a plan to build an electrodeposited copper foil factory in Malaysia as the company expects demands to rapidly grow in Asia.

The nonferrous metal company plans to invest about 15 billion yen (137.22 million dollars) for a new plant to be located next to an existing factory in Shah Alam, Selangor, the company said.

The firm plans to complete the first phase of construction and start operations with a monthly output of 700 tons of electrodeposited copper foil by the beginning of 2010, with an aim to expand its production capacity to total 1,200 tons.

The Japanese company is hoping to lead the market with a total production capacity of 2,800 tons per month at both facilities.

The product is used in printed circuit board for electronic devices.